RTP processes

First type of processes can be called resident reactions in which heat is applied to modify already existing materials structure in or on the wafer with no additional external materials. Typical processes of resident reactions are:
Second type of processes can be called surface interaction in which heat causes modification of the wafer surface by gases spread over it. The difference with the first category, is that material under the form of reactive gas is added during the heating process. Examples are:
  • Oxidation
  • Nitridation
  • Selenization
  • Silicon carbonization

The last type of RTP process would be deposition (RTCVD) for Rapid Thermal Process based on Chemical Vapor Deposition

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