Our DLI systems have been designed to offer the widest process versatility

These machines can perform different types of processes inside the same chamber: DLI-CVD, DLI-ALD, DLI pulse pressure CVD. The two-inch machine can in addition run infrared assisted ALD and CVD, RTP, RTCVD and MOCVD processes.

The applications are:
  • Simple and multi-metallic oxides (see application notes)
  • Nitrides, metals, and alloys
  • 2D and 3D materials
  • III-V, wide band gap semiconductors
  • Etc.
Example of deposited materials:
  • Oxydes: BaO,  Y2O3,  Cr2O3,  TiO2,  Al2O3,  HfO2,  Li2O,  SiO2, LIPON, Bi2O3, Co3O4, CuCrO2, SiO2,  LiNbO3, LaNiO3, SiZrOx, SrTiO3, BaTiO3, MovCrwFexBiyOz
  • 2D materials: Graphene, h-BN, TMDs (MoS2, WS2, etc.)
  • Metals: Pt, Mo, W, Ru ….
  • Nitrides: TiN, AlN

Advantages and drawbacks of Direct Liquid Injection, Vapor draw, bubbler