Intercovamex H2

The Intercovamex H2 High Vacuum deposition system is well recognized as a suitable system for new materials and advanced coatings for R&D purposes due to its easy position change of accessories as well as its operational flexibility for different applications as nanotechnology, MEMS, hard coatings, transparent conductor coatings, photovoltaics and several semi-conductive materials. The H2 is optimized for PVD (Physical Vapor Deposition) for up to 6 materials by sputtering or evaporation (simultaneous or sequential) and is recommended for substrates of 100 mm diameter (125 mm max.) or 100 x 100 mm

Up to 6 magnetrons for 25mm diameter targets, 4 magnetrons for 25mm, 50mm or 75mm diameter targets or, 2 magnetrons for 100mm diameter targets can be mounted on the bottom flange (sputtering up geometry). Each magnetron is equipped with an electro-pneumatic shutter with rotary or flip type motion. Swing type motion is optional. Each magnetron is installed on a bellow to optimize homogeneity of deposition and co-sputtering. Each magnetron can generate a DC, pulsed DC or RF plasma. Maximum power depends on the model of magnetron. For RF a low cost manual impe-dance matching networked is offered. An automatic one is recommended for long-term and unattended deposition. A re-circulating water chiller is necessary to cool the magnetron\'s magnets, it is offered as an option if not available in the laboratory.