RTP / RTCVD processes

Rapid thermal process can be divided in three different classes of application: resident reaction, surface interaction, deposition (RTCVD)

Substrates

The cold wall chamber technology and the extended temperature range of our Rapid Thermal Processing associated with optimized susceptors allow processing the widest range of substrates:
  • Silicon wafers
  • Compound semiconductor wafers
  • GaN/Sapphire wafers for LEDs
  • Silicon carbide wafers
  • Poly silicon wafers for solar cells
  • Glass substrates
  • Metals
  • Polymers