Rapid Thermal Processing furnaces & Chemical Vapor Deposition systems
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Annealsys manufactures systems for
Rapid Thermal Processing
and
Chemical Vapor Deposition
.
Annealsys offer additional process solutions with
ALD
machines from
Cambridge NanoTech
(USA) and
Sputtering
and plasma equiment from FHR (Germany)
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AS-One
Rapid Thermal Processing
cold wall chamber furnaces
4-inch (100 mm) and 6-inch (150 mm) versions
Applications
RTA (
Rapid Thermal Annealing
)
RTO (
Rapid thermal oxidation
)
Diffusion, contact annealing
Compound semiconductor annealing
Nitridation, Silicidation, Selenization, Sulfurization
Crystallization and Densification
Specifications
4-inch and 6-inch wafer capability
Floor standing system for reduced footprint
High reliability and low cost of ownership
Stainless steel cold wall chamber technology:
High process reproducibility
Ultra clean and contamination-free environment.
High cooling rates and low memory effect
A high vacuum version (10-6 mbar) is available
Pyrometer and thermocouple control
Fast digital PID temperature controller
Edge pyrometer viewport insures enhanced temperature control of the susceptor for compound semiconductors and small samples.
Performance & characteristics
Temperature range: RT to 1500°C
Ramp rate up to 200°C/s
Cooling rate up to 100°C/s with special equipment
Gas mixing capability with mass flow controllers
Vacuum range: Atmosphere to 10-6 Torr
Photos
Datasheet
Datasheet English
Datasheet Français
Datasheet Español